X-ray Microtomography is a Non-destructive Technique (NDT) used x-rays to allow inspection at multiple magnifications, angles with X-ray source settings. In Semiconductor industry, it is commonly used to examine wire bonding, die attach voiding etc. In 3D Mode, the X-ray create cross-sections of a physical object and recreate a virtual model (3D model) without destroying the original object. Hence in reality, virtually all tomography today is computed tomography.
•Internal structuaral damaged/defects
•Industrial computed tomography