Description

Specially suitable for the Failure Analysis of Integrated Circuit(IC), the Reactive Ion Etching (RIE) technique is most importance for de-layering. With the combination of wet and dry processing, RIE is used to perform deconstruction by keeping planar alignment across every levels of de-layering.

It is added advantage when use together with Electron Dispersion Spectroscopy (EDS) where the information can be generated simultaneously to identify coatings and contaminants present on the specimens.